Camera layout: 2D (single camera), 2.5D (3 cameras system)
Lightings: coaxial, ring, low angle square light; white light and RGB
Detection
Line (hair line crack, scratches) detection: 5um above (based on width)
Area detection: 5um above (longest of any two directions)
Color detection: grey scale different of 30% between the interest and background
Special detection: water mark(dried) on glass
Outstanding Ability
Higher UPH than most competitors at same price category (almost 2X)
Capable of detecting: particles (5um), micro crack (10um)
Able to vacumm suction on MEMS products, special design.
Unique software to enable vision inspection by layers and zones (for hybrid products that have IC and PCB). Inspection capability is 10um vs SMT machine 30um.
Special Algorithm
Crack inspection tool
DefFinder tool
DefFinder + Blob tool
Multi filtering options
3D tool
Expandable algorithm using standard tool
AOI (GEMi)
Outstanding Ability
Higher UPH match up to Dies Bond machine by using dual camera systems.
Capable of detecting: five expoxy colors types, inclusive semi clear.
Programmable indexer track width (software conversion based on products recipe)
